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CVE-2022-33226

MEDIUM
Published 2023-06-06T07:38:36.613Z
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CVSS Score

V3.1
6.7
/10
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Base Score Metrics
Exploitability: N/A Impact: N/A

EPSS Score

v2023.03.01
0.000
probability
of exploitation in the wild

There is a 0.0% chance that this vulnerability will be exploited in the wild within the next 30 days.

Updated: 2025-01-25
Exploit Probability
Percentile: 0.149
Higher than 14.9% of all CVEs

Attack Vector Metrics

Attack Vector
LOCAL
Attack Complexity
LOW
Privileges Required
HIGH
User Interaction
NONE
Scope
UNCHANGED

Impact Metrics

Confidentiality
HIGH
Integrity
HIGH
Availability
HIGH

Description

Memory corruption due to buffer copy without checking the size of input in Core while processing ioctl commands from diag client applications.

Available Exploits

No exploits available for this CVE.

Related News

No news articles found for this CVE.

Affected Products

Qualcomm, Inc.

Snapdragon

Affected Versions:

AQT1000 FastConnect 6200 FastConnect 6900 FastConnect 7800 QAM8255P QCA6420 QCA6430 QCA6574AU QCA6595AU QCA6698AQ QCA6797AQ SA8255P SD855 Snapdragon 8 Gen 1 Mobile Platform Snapdragon 855 Mobile Platform Snapdragon 855+/860 Mobile Platform (SM8150-AC) Snapdragon 888 5G Mobile Platform Snapdragon 888+ 5G Mobile Platform (SM8350-AC) Snapdragon Wear 4100+ Platform WCD9341 WCD9380 WCD9385 WCN3610 WCN3660B WCN3680B WCN3980 WSA8810 WSA8815 WSA8830 WSA8835

References

https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
Published: 2023-06-06T07:38:36.613Z
Last Modified: 2024-08-03T08:01:20.485Z
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