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CVE-2023-21640

MEDIUM
Published 2023-07-04T04:46:36.134Z
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CVSS Score

V3.1
6.7
/10
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Base Score Metrics
Exploitability: N/A Impact: N/A

EPSS Score

v2023.03.01
0.000
probability
of exploitation in the wild

There is a 0.0% chance that this vulnerability will be exploited in the wild within the next 30 days.

Updated: 2025-01-25
Exploit Probability
Percentile: 0.149
Higher than 14.9% of all CVEs

Attack Vector Metrics

Attack Vector
LOCAL
Attack Complexity
LOW
Privileges Required
HIGH
User Interaction
NONE
Scope
UNCHANGED

Impact Metrics

Confidentiality
HIGH
Integrity
HIGH
Availability
HIGH

Description

Memory corruption in Linux when the file upload API is called with parameters having large buffer.

Available Exploits

No exploits available for this CVE.

Related News

No news articles found for this CVE.

Affected Products

Qualcomm, Inc.

Snapdragon

Affected Versions:

FastConnect 6900 FastConnect 7800 Snapdragon 8 Gen 1 Mobile Platform WCD9380 WSA8830 WSA8835
qualcomm

snapdragon

Affected Versions:

fastconnect_6900 fastconnect_7800 snapdragon8_gen1_mobile_platform wcd9380 wsa8830 wsa8835

References

https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
Published: 2023-07-04T04:46:36.134Z
Last Modified: 2024-11-26T18:56:23.022Z
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