Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Required Action

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

References

• This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110
• https://nvd.nist.gov/vuln/detail/CVE-2023-33063

Additional Information

Catalog Version

2025.01.24

Catalog Released

Jan. 24, 2025

Days Until Due

0 days

Last Updated

6 months ago